Please tell us about yourself
Sujay Singh received the Ph.D. degree in physics from The State University of New York at Buffalo, Buffalo, NY, USA, in 2016. He did his masters deh=gree in Physics from Banaras Hindu University. Sujay started his career at Fairchild Semiconductor as a Thermal Characterization Reliability Engineer in 2015. He is currently a Principal Reliability Engineer at ON Semiconductor, Mountain Top, PA, USA, and is involved in the process, device, and packaging development teams to assess the thermal and mechanical properties and reliability of power semiconductor packaging.
How did your experience in the Department of Physics prepare you for your career?
The rigorous training during the coursework and graduate research improved my ability to think critically and creatively, improved my communication skills, prepared me to work well under pressure, and developed my ability to network effectively. The Department of Physics provided me an opportunity to start disciplinary and interdisciplinary research collaborations with faculty members right from the beginning that led to several publications in high-impact journals.
What have you been up to since leaving UB?
I joined Fairchild Semiconductor as a Reliability Engineer IV in October 2015 before my graduation in February 2016. In September 2016, Fairchild Semiconductor was acquired by ON Semiconductor. Currently, I am working as a Principal Reliability Engineer at ON Semiconductor, Mountain Top, PA.
Can you tell us about your job and your responsibilities?
My job responsibilities include thermal and mechanical characterizations of electronic packages including thermal impedances, materials surface interfacial properties, safe operating area, electrical and mechanical degradation from power cycling, and other reliability tests. I am working with process, device, and packaging development teams to assess the reliability of new power semiconductor products, the impact of changes in existing power semiconductor processes and packaging, including reliability relating to chip-package interactions. In addition, I am working with product engineers to estimate failure rates on power semiconductor products and ensuring products meet and exceed applicable industrial standards.
Do you have any advice for current UB physics students?
My advice is to determine your area of interest, identify an advisor/research group, and start working on your graduate research as early as possible. Manage your time effectively, be persistent, and collaborate as much as possible.